Best Xperia Z Cases and Covers

Sony Xperia Z is one of the sleekest and toughest phones of all times. The company says that this phone is rugged enough that it does not requires any sort of protection. Some of us differ from that philosophy and do like to give our expensive phone some good protection.  So, here is the list of some of the best cases and covers for Xperia Z.

Krusell Xperia Z case – I have found this to be the thinnest one so far. The case shows off the XPERIA logo on the back too.

krusell xperia z casekrusell xperia z

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Core i7-3612QM Specs

Core i7-3612QM Specs

Series    Intel Core i7
Codename    Ivy Bridge
Clock Rate    2100 – 3100 MHz
Level 1 Cache    256 KB
Level 2 Cache    1024 KB
Level 3 Cache    6144 KB
Number of Cores / Threads    4 / 8
Max. Power Consumption (TDP = Thermal Design Power)    35 Watt
Transistor Count    1400 Million
Manufacturing Technology    22 nm
Die Size    160 mm2
Max. Temperature    105 °C
Socket    FCBGA1224, FCPGA988
Features    HD Graphics 4000 (650-1100MHz), DDR3(L)-1600 Memory Controller, HyperThreading, AVX, Quick Sync, Virtualization
64 Bit    64 Bit support
Hardware Virtualization    VT-x, VT-d
Announcement Date    04/23/2012

Core i7-2720QM specs

Core i7-2720QM specs

Series    Intel Core i7
Codename    Sandy Bridge
Clock Rate    2200 – 3300 MHz
Level 1 Cache    256 KB
Level 2 Cache    1024 KB
Level 3 Cache    6144 KB
Number of Cores / Threads    4 / 8
Max. Power Consumption (TDP = Thermal Design Power)    45 Watt
Transistor Count    995 Million
Manufacturing Technology    32 nm
Die Size    216 mm2
Max. Temperature    100 °C
Socket    FCBGA1224, FCPGA988
Features    HD Graphics 3000 (650-1300MHz), DDR-1600 Memory Controller, HyperThreading, AVX, Quick Sync, Virtualization
64 Bit    64 Bit support
Hardware Virtualization    VT-x, VT-d
Starting Price     $378 U.S.
Announcement Date    01/06/2011

Core i3-2367M specs

Core i3-2367M specs

Series    Intel Core i3
Codename    Sandy Bridge
Clock Rate    1400 MHz
Level 1 Cache    128 KB
Level 2 Cache    512 KB
Level 3 Cache    3072 KB
Number of Cores / Threads    2 / 4
Max. Power Consumption (TDP = Thermal Design Power)    17 Watt
Transistor Count    624 Million
Manufacturing Technology    32 nm
Die Size    149 mm2
Max. Temperature    100 °C
Socket    FCBGA1023
Features    HD Graphics 3000 (350-1000MHz), DDR3-1066/1333 Memory Controller (max 8GB), HyperThreading, AVX, Quick Sync, Virtualization
64 Bit    64 Bit support
Hardware Virtualization    VT-x
Announcement Date    06/27/2011