Just like Samsung introduced flip cases for the Galaxy Note 1 and Note 2, it has released one for the Galaxy Note 8.0. These will be made available in five colors as shown in the image below – dark grey, pink, white, red and lime.
Continue reading “Galaxy Note 8.0 Official Flip Case Review”
Core i7-2760QM specs
Series Intel Core i7
Codename Sandy Bridge
Clock Rate 2400 – 3500 MHz
Level 1 Cache 256 KB
Level 2 Cache 1024 KB
Level 3 Cache 6144 KB
Number of Cores / Threads 4 / 8
Max. Power Consumption (TDP = Thermal Design Power) 45 Watt
Transistor Count 995 Million
Manufacturing Technology 32 nm
Die Size 216 mm2
Max. Temperature 100 °C
Socket FCBGA1224, FCPGA988
Features HD Graphics 3000, DDR-1333 Memory Controller, HyperThreading, AVX, Quick Sync, Virtualization
64 Bit 64 Bit support
Hardware Virtualization VT-x, VT-d
Starting Price $378 U.S.
Announcement Date 09/03/2011
Samsung has launched Galaxy Note 8.0, dubbed as Note 510 in India. Price of Galaxy Note 510 is expected to close to 25000 Indian Rupees or less. Official price will be announced in mid-March 2013 and will be available in the market by end of March (or early April 2013).
Continue reading “Galaxy Note 8.0 510: India Price, availability”
Core i7-3632QM Specs
Series Intel Core i7
Codename Ivy Bridge
Clock Rate 2200 – 3200 MHz
Level 1 Cache 256 KB
Level 2 Cache 1024 KB
Level 3 Cache 6144 KB
Number of Cores / Threads 4 / 8
Max. Power Consumption (TDP = Thermal Design Power) 35 Watt
Transistor Count 1400 Million
Manufacturing Technology 22 nm
Die Size 160 mm2
Max. Temperature 105 °C
Socket FCBGA1224, FCPGA988
Features HD Graphics 4000, DDR3(L)-1600 Memory Controller, HyperThreading, AVX, Quick Sync, Virtualization
64 Bit 64 Bit support
Hardware Virtualization VT-x, VT-d
Announcement Date 09/30/2012
Core i5-3339Y Specs
Series Intel Core i5
Codename Ivy Bridge
Clock Rate 1500 – 2000 MHz
Level 1 Cache 128 KB
Level 2 Cache 512 KB
Level 3 Cache 3072 KB
Number of Cores / Threads 2 / 4
Max. Power Consumption (TDP = Thermal Design Power) 13 Watt
Manufacturing Technology 22 nm
Max. Temperature 105 °C
Socket BGA
Features Turbo Boost 2.0, Hyper-Threading, Virtualization VT-x, AES, Intel 64, Anti-Theft, My Wi-Fi, Idle States, Enhanced Speed Step, Thermal Monitoring, Execute Disable Bit
64 Bit 64 Bit support
Hardware Virtualization VT-x
Core i7-2649M specs
Series Intel Core i7
Codename Sandy Bridge
Clock Rate 2300 – 3200 MHz
Level 1 Cache 128 KB
Level 2 Cache 512 KB
Level 3 Cache 4096 KB
Number of Cores / Threads 2 / 4
Max. Power Consumption (TDP = Thermal Design Power) 25 Watt
Transistor Count 624 Million
Manufacturing Technology 32 nm
Die Size 149 mm2
Max. Temperature 100 °C
Socket BGA1023
Features HD Graphics 3000 500-1100MHz, integrated DDR3-1333 memory controller, Virtualization, Trusted Execution, Hyper-Threading, Turbo Boost 2.0
64 Bit 64 Bit support
Hardware Virtualization VT-x
Announcement Date 01/03/2011
