ECS Liva Mini PC and Alexa headset launched at Computex 2018

ECS Liva Mini PC

ECS Elitegroup at Computex 2018 is pretty much about Amazon’s smart voice assistant Alexa, but it’s also about Liva’s in-house ultra-compact PCs. At the Computex stand at ECS shown there are the first Liva systems with integrated touchscreen and integrated battery. The reason: They should be able to control Amazon’s voice assistant Alexa, even away from the Android smartphone or their own echo systems. Of course, all features that Alexa offers are supported. It is possible, among other things, playing music, controlling smart home devices and of course ordering at Amazon via voice control.

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ASRock B450M Pro 4, B450M-HDV, B450 Gaming K4 released at Computex 2018

ASRock was seen with five B450 boards at the Computex 2018. Some are ATX, while others are either Micro-ATX or Mini-ITX. ASRock has released at least one model for each format. In addition to three boards from the Pro series, two models of the Fatal1ty gaming series were shown as well. The B450M Pro 4 and the B450M-HDV are produced in Micro ATX format, with the Pro4 basically offering better features. The maximum RAM expansion amounts to 64 GB instead of “only” 32 GB. But even with the power supply of CPU and RAM Pro4 is the HDV slightly superior to the higher number of phases.

asrock

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Shuttle XPC SZ270R9 Review: a barebone mini PC for gaming

Shuttle XPC SZ270R9

The Shuttle SZ270R9 means a clear evolution in terms of the design that Shuttle was developing in its barebones. It is true that it does not renounce the high quality materials such as aluminum but as true as the previous statement is that Shuttle is one of the last manufacturers in which we would think that it is going to point to the fashion of LED RGB lighting. And that is called Marketing or, as some say, renew or die. There is a growing desire to give that touch of originality to the PC and, in a world where everything is invented, that touch of originality is obtained with designs, at least, carefree, cheerful and, why not, a little aggressive.

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AMD Ryzen 5 2500X and AMD Ryzen 3 2300X specifications now available

AMD Ryzen 5 2500X and AMD Ryzen 3 2300X specifications

Today, we have come to know more about the specifications of the new models Ryzen 3 2300X and 2500X Ryzen 5, as well as energy – efficient models E. The names of these processor models are not a novelty for anyone, they have been appearing for some time on some pages of motherboard manufacturers, but today we fill in some gaps in their specification tables.

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Cryorig H7 Ultra RGB and Crona 120: new heatsink and high performance fan

Cryorig has announced its new H7 Ultra RGB heatsink and its new Crona 120 fan that will show us at the Computex 2018 in Taiwan. This presentation has been an overview for the media to know what to look for in their stand. The brands get to work to show us all their artillery for this new event and Cryorig has already presented several very striking components for next week.

Cryorig H7 Ultra RGB and Crona 120

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Intel QLC-NAND 2.5-inch SSD with 20 TB in the works

Intel QLC-NAND

Intel could be on the verge of releasing an SSD with a storage capacity of up to 20 TB. The largest SSD in the chip giant’s portfolio offers significantly less capacity at 8TB, but with the help of the latest QLC NAND, this is soon to be a thing of the past. With the QLC-NAND, four bits are stored per memory cell, which simultaneously increases the storage density. This makes it possible to achieve a high capacity with a few chips.

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Xiaomi Mi Band 3 launched: better and more comfortable than predecessor–price and specifications

Xiaomi Mi Band 3

The fitness bracelet Mi Band 2 by the Chinese manufacturer Xiaomi is certainly one of the most popular models in this field. This is mainly due to the low selling price of around 20 euros. Now the manufacturer wants to build on the success and sends for this the third generation of his smart bracelet in the race.

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Samsung SO-DIMM with 32 GB launched

Samsung has introduced a new SO-DIMM, which has a capacity of 32 GB. According to Samsung, the memory is based on a 10 nm class process technology – the manufacturer does not elaborate on this. At 10-nm class is a process node with 10 to 19 nm. The previous chips each having 8 Gbit capacity Samsung made in 18 nm, the new 16-Gb chips will have experienced a small Shrink.

Samsung SO-DIMM with 32 GB

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